HyperAIHyperAI

Command Palette

Search for a command to run...

Cadence Launches Industry-First DDR5 12.8Gbps MRDIMM Gen2 IP for Enhanced AI and Data Center Performance

Cadence has announced the industry's first DDR5 12.8Gbps Multi-Rank DIMM (MRDIMM) Gen2 memory IP system solution, which is now available on the TSMC N3 (3-nanometer) process. This new solution is designed to address the growing need for increased memory bandwidth in AI and other high-performance computing (HPC) applications, particularly in data centers and enterprise environments. The DDR5 MRDIMM IP system solution from Cadence includes a physical interface (PHY) and a high-performance controller, forming a comprehensive memory subsystem. This system has been validated in hardware using the latest MRDIMMs (Gen2) and has achieved a best-in-class data rate of 12.8Gbps, effectively doubling the bandwidth of the current DDR5 6400Mbps DRAM parts. The memory subsystem is built on Cadence’s silicon-proven, high-performance architecture, which features ultra-low latency encryption and industry-leading reliability, availability, and serviceability (RAS) features. The scalable and adaptable design of the DDR5 IP solution allows for flexible floorplan options, making it easier to integrate into advanced system-on-chip (SoC) and chiplet products. The new architecture also enables fine-tuning of power consumption and performance to meet the specific demands of various applications, such as AI, machine learning (ML), and HPC. Micron Technology, a leading DRAM provider, has partnered with Cadence to ensure that the DDR5 IP portfolio, when used with Micron’s 1γ (1-gamma)-based DRAM, meets the increasing demand for higher memory bandwidth, density, and reliability. Praveen Vaidyanathan, vice president and general manager of Micron’s Data Center Products, emphasized the importance of these memory enhancements for enabling next-generation AI/ML and HPC applications. Montage Technology, another key partner, has developed MRDIMM buffers that support the 12.8Gbps data rate. Stephen Tai, president at Montage Technology, highlighted that Montage’s MRCD02/MDB02 chips for MRDIMMs are ready to enhance server and data center products by doubling the bandwidth. Boyd Phelps, senior vice president and general manager of the Silicon Solutions Group at Cadence, noted that the new DDR5 memory IP system is already attracting significant interest from large customers. The solution not only delivers a performance boost but also provides a roadmap for future innovations, ensuring that customers’ SoC and chiplet products remain competitive for years to come. Cadence’s DDR5 controller and PHY have been thoroughly verified with Cadence’s Verification IP (VIP) for DDR, which includes a complete solution from IP to system-level verification. The verification process ensures that the IP and SoC designs meet the required performance standards and can be integrated with confidence. The suite of tools includes DFI VIP, a DDR5 memory model, and a System Performance Analyzer, all of which are crucial for achieving rapid verification closure. The DDR5 12.8Gbps MRDIMM Gen2 memory IP system solution is particularly timely as AI and HPC applications continue to push the boundaries of memory performance. High-memory bandwidth is essential for handling complex AI workloads, which require vast amounts of data to be processed quickly. By providing a memory solution that can handle these demands, Cadence is positioning itself as a leader in the rapidly evolving field of AI and cloud computing. Industry insiders have praised this development, noting that it represents a significant leap forward in memory technology. The combination of Cadence’s IP and Micron’s DRAM, along with Montage’s buffer chips, is seen as a powerful trio that will drive innovation and performance in the data center and enterprise sectors. This solution is expected to become a standard for high-performance memory systems, setting new benchmarks for reliability and efficiency. Cadence Design Systems, Inc. is a global leader in electronic design automation (EDA) and semiconductor solutions. The company’s Intelligent System Design strategy focuses on integrating computational software to accelerate innovation across the entire chip-to-system design process. Cadence’s solutions are widely used by top technology companies, including those in hyperscale computing, mobile communications, automotive, aerospace, industrial, life sciences, and robotics. The company was recognized by the Wall Street Journal in 2024 as one of the world’s top 100 best-managed companies. To learn more about Cadence and their DDR5 IP solutions, visit their website at www.cadence.com. In sum, Cadence’s DDR5 12.8Gbps MRDIMM Gen2 memory IP system solution is a groundbreaking development that addresses the critical need for high-memory bandwidth in AI and HPC applications. It is already gaining traction in the market, with major industry players like Micron and Montage providing essential components to complement Cadence’s solution. This partnership is poised to set new standards in data center and enterprise memory technologies.

Related Links