Nintendo Switch 2 SoC Detailed: 8x A78C Cores, 1,536 Ampere Shaders, and Samsung's 8N Process Revealed

While we still have a month before the Nintendo Switch 2 makes its official debut, hardware analyst Geekerwan has managed to obtain an engineering board of the device, providing unprecedented insight into the Switch 2’s internal specifications. Notably, he conducted a detailed analysis of the Tegra T239 System-on-Chip (SoC) using a Focused Ion Beam Scanning Electron Microscope (FIB-SEM), a sophisticated tool that allows for layer-by-layer examination of the chip’s structure. Given Nintendo's strict policy against leaks and its history of legal action, the acquisition and analysis of this board are remarkable. Geekerwan’s analysis reveals that the Switch 2’s SoC, codenamed "Tegra T239," is approximately 207 mm² in size, nearly double the 105 mm² of the previous Switch’s X1 SoC (Tegra T210). The SoC was manufactured in 2021, suggesting that the Switch 2 was initially planned for an earlier release but faced delays for unspecified reasons. The T239 is fabricated using a customized Samsung 8N process, which blends features from Samsung’s 10nm and 8nm nodes. This choice is a strategic balance between cost and performance, as transitioning to a more advanced 5nm process would have required significant redesign and validation efforts, potentially increasing production costs and complexity. The heart of the Tegra T239 is its CPU, which features 8 Arm Cortex-A78C cores, each with 256 KB of private L2 cache. These cores share a 4 MB L3 cache, enhancing data throughput and reducing latency. The CPU is closely related to Nvidia’s Tegra T234 used in the Jetson Orin development kit, although the core sizes differ slightly. Each A78C core in the T239 measures 2.4 mm², similar to the A78AE cores in the T234. Complementing the CPU is an Ampere-based GPU, likely derived from the GA10B die, featuring 6 Texture Processing Clusters (TPCs) and 12 Streaming Multiprocessors (SMs), for a total of 1,536 CUDA cores. Each SM in the T239 is 2.71 mm², making it 22% smaller than the T234’s 3.47 mm² SMs. This reduction in size could contribute to better thermal management and power efficiency, crucial factors for a handheld console. Interestingly, the SMs in both the T239 and T234 are larger than those in the GA102 die used in the RTX 3090, which measures 2.57 mm² per SM. Beyond the SoC, the engineering board includes a robust storage solution and connectivity options. It is equipped with 256 GB of TLC-based UFS 3.1 storage from SK hynix, offering faster read and write speeds compared to the previous Switch. For wireless connectivity, the board sources Wi-Fi and Bluetooth modules from MediaTek, ensuring reliable and high-speed data transfer. Power delivery is managed by a built-in system capable of supplying up to 34.4W, although actual usage is expected to be lower. The memory configuration consists of 12 GB of LPDDR5x-8533 RAM, also provided by SK hynix. To optimize battery life and thermal performance, this RAM is likely to be downclocked to 6400 MT/s in docked mode and 4266 MT/s in handheld mode, mirroring the previous Switch's approach. Geekerwan’s initial performance tests, using an underclocked RTX 2050 laptop GPU to emulate the Switch 2, suggest that the docked configuration may perform similarly to a GTX 1050 Ti, while the handheld configuration is closer to a GTX 750 Ti. These comparisons are approximate, as the RTX 2050 and the Switch 2’s GPU architecture differ significantly. Nevertheless, they provide a rough benchmark that places the Switch 2’s performance slightly below that of the Steam Deck in handheld mode. Industry experts note that the use of the 8N process and the A78C cores strikes a balance between performance and cost efficiency, aligning with Nintendo's strategy of delivering value without breaking the bank. While the Switch 2 may not be a massive leap in raw performance compared to the latest gaming consoles, it represents a significant upgrade over the original Switch. Additionally, the potential for future mid-gen refreshes using more advanced processes, such as 5nm or 3nm, could further enhance the console's capabilities. Nintendo remains tight-lipped about the Switch 2’s full specifications, but Geekerwan’s deep dive provides a clearer picture of what to expect. The combination of powerful CPU and GPU cores, efficient power management, and improved storage and connectivity suggests a more capable and versatile device. Once the official embargo lifts next month, we can anticipate more detailed performance evaluations and feature overviews. Industry Insights and Company Profiles: The analysis by Geekerwan highlights Nintendo’s focus on balancing performance and cost-effectiveness. By leveraging Samsung’s 8N process, Nintendo avoids the substantial financial and logistical challenges associated with adopting a 5nm process, while still delivering a noticeable performance improvement over the current model. This approach is consistent with Nintendo's historical strategy of emphasizing unique software and hardware experiences rather than chasing cutting-edge technology. The Tegra T239 SoC, with its powerful A78C cores and Ampere GPU, sets a solid foundation for the Switch 2, preparing it for a wide range of gaming scenarios, from handheld play to docked gaming on larger displays.