Intel Unveils 18A-PT Variant with 3D Die Stacking and Advances 14A Process Node

At Intel's Intel Foundry Direct 2025 event in San Jose, California, new CEO Lip Bu-Tan detailed significant advancements in the company’s foundry initiatives. One of the major highlights is the engagement of lead customers for the upcoming 14A process node, which is expected to be the industry's first to employ High-NA EUV lithography. Intel is also making strides with its 18A node, which is now in risk production, with volume manufacturing scheduled for later this year. 14A Process Node The 14A process node, the successor to the 18A node, is already in the works. Intel aims for this node to be the first in the industry to use High-NA EUV (Extreme Ultraviolet) lithography, a technology that significantly improves precision and feature density. While TSMC’s A14 node, expected to debut in 2028, will not use High-NA EUV, Intel's 14A is set to offer a competitive edge in terms of advanced manufacturing capabilities. The company has shared early versions of the Process Design Kit (PDK) with lead customers, enabling them to design and validate new processor architectures. Multiple customers have already expressed their intent to build chips using the 14A process, highlighting its market potential. A key feature of the 14A node is the second-generation PowerVia backside power delivery technology, now called PowerDirect. This technology delivers power directly to each transistor’s source and drain via specialized contacts, minimizing resistance and maximizing efficiency. It represents a more advanced and direct method compared to the current PowerVia scheme, which uses Nano Through-Silicon Vias (TSVs). In contrast, TSMC’s N2 node lacks a backside power delivery network, although the company plans to introduce it with its A16 node, set for late 2026. 18A Process Node and Variants Intel's 18A node (1.8nm equivalent) has entered risk production, with High Volume Manufacturing (HVM) planned for the end of this year. This node is notable for being the first to integrate both PowerVia backside power delivery and RibbonFET gate-all-around (GAA) transistors. PowerVia optimizes power routing, enhancing performance and density, while RibbonFET technology offers better density and faster switching speeds by using four vertical nanosheets fully surrounded by the gate. Intel is also developing line extensions of the 18A node to cater to diverse use cases. One such variant is the 18A-P, designed for high performance and featuring an optimized power and frequency curve, resulting in a 5-10% improvement in performance per watt. Another variant is the 18A-PT, which supports Foveros Direct 3D hybrid bonding. This technology allows bumpless copper-to-copper connections, fusing chiplets with a pitch of less than 5 microns, which is a significant improvement over the company’s initial goal of a 10nm pitch by 2023. TSMC currently uses a similar technology, SoIC-X, with a 9-micron pitch, but Intel's implementation is set to match or surpass this standard. Intel’s Clearwater Forest, the first product to utilize Foveros Direct 3D packaging, uses the Intel 3-T node for the base die with 18A compute dies stacked on top. This setup enables the integration of SRAM cache chiplets, a logical application for this advanced packaging technology. The 18A-P and 18A-PT nodes are design rule-compatible with the 18A node, simplifying the design process for customers and facilitating collaboration with EDA software vendors and IP designers. Mature Nodes: 16nm and 12nm Intel Foundry is also advancing its mature nodes to remain competitive in a variety of markets. The company’s 16nm node, derived from its 22FFL node, is now in production with tapeouts in the fab. This node leverages industry-standard design tools and PDKs, making it accessible and user-friendly for customers. In partnership with UMC, Intel is developing a 12nm node aimed at mobile communication infrastructure and networking applications. Production of this node is set to begin in 2027 across three of Intel’s Arizona fabs. Currently, Intel is engaging lead customers for the 12nm node, demonstrating its commitment to providing solutions for a broad range of applications. Ecosystem Expansions A significant aspect of Intel’s strategy is its ongoing expansion of partnerships with EDA and IP providers. The company has established the Intel Foundry Accelerator Alliance, which includes the Chiplet Alliance and Value Chain Alliance programs. These alliances aim to simplify the design and production processes for potential foundry customers by offering interoperable and validated chiplets and design tools. Intel’s advanced packaging services, including its 3D stacking Foveros implementation, are crucial for rapid revenue generation. The company announced a new partnership with Amkor to enhance these services, although details are limited for now. These alliances and services are pivotal for Intel’s ambition to reclaim the manufacturing leadership from its rivals, particularly in light of geopolitical tensions affecting the global chip supply chain. Geopolitical Context Intel's progress occurs amid turbulent times in the semiconductor industry, where geopolitical divisions threaten the global chip supply chain. As the only US-based supplier of leading-edge process node technology and advanced packaging capacity, Intel holds a strategic advantage. Recent laws in Taiwan prohibit TSMC from producing its most advanced technology in the US, leaving Intel as the sole domestic foundry capable of both leading-edge chip production and R&D. This unique position is likely to attract more customers looking to mitigate supply chain risks. Industry Expert Insights Industry insiders have praised Intel's aggressive roadmap and technological advancements, particularly in the realm of advanced packaging and backside power delivery. The introduction of High-NA EUV in the 14A node and the innovative 18A-PT variant are seen as strong responses to competitors like TSMC. Intel's broad ecosystem of EDA and IP partners is viewed as a robust foundation for supporting its foundry services, ensuring a wide array of options for customers and accelerating time-to-market for new designs. Intel Foundry's strategic focus on both cutting-edge and mature nodes underscores its commitment to serving a diverse range of applications and markets. The company’s leadership in advanced packaging technologies, such as Foveros Direct 3D, positions it favorably against TSMC, especially in light of growing geopolitical uncertainties that may limit TSMC's capabilities in the US market.