TDK Corporation’s venture arm, TDK Ventures, has invested in Mixx Technologies, a San Jose-based pioneer in next-generation optical interconnect solutions, as part of a $33 million Series A funding round led by ICM HPQC Fund. The investment aims to accelerate Mixx’s development of its HBxIO™ optical engine, a co-packaged optics (CPO) platform designed to overcome critical data bottlenecks in Artificial Intelligence (AI) and High-Performance Computing (HPC). The platform enables switchless GPU clusters, delivering highly parallelized, low-latency AI compute performance by integrating photonics and advanced packaging at the system level—from rack to chip. Mixx Technologies was founded by Vivek Raghuraman (CEO) and Rebecca K. Schaevitz, Ph.D. (Chief Product Officer), both former leaders from Broadcom’s CPO team with extensive experience at companies like Intel, Corning, and Rockley Photonics. Their expertise has enabled the company to develop a system-level approach that optimizes performance, power efficiency, latency, and reliability across datacenter infrastructure. Unlike traditional interconnects, Mixx’s solution eliminates the need for intermediate switches, significantly reducing complexity and improving scalability for AI workloads. Nicolas Sauvage, President of TDK Ventures, praised Mixx as a prime example of deep-tech innovation that strengthens the entire AI ecosystem. He emphasized the strategic importance of the company’s ultra-high radix optical engine and systems-first design, which he said bridges physical and digital infrastructure to enable more efficient, sustainable, and scalable AI compute. TDK Ventures views this investment as part of its broader mission to support frontier technologies in materials science, energy, and advanced electronics—areas critical to the future of AI, robotics, and industrial innovation. The funding round, which included participation from SystemIQ Capital and Applied Ventures, was oversubscribed, reflecting strong market confidence in Mixx’s technology and its potential to redefine AI infrastructure. The company’s goal is to deliver higher performance per dollar and per watt, enabling cost-effective scaling of AI systems through open standards that ensure reliable and efficient data movement. Mixx Technologies is headquartered in San Jose, with operations in India and Taiwan, and is focused on building the foundational connectivity fabric for the next generation of AI applications. Its platform is designed to support the most demanding workloads, from large-scale AI inference to future HPC systems, by removing the limitations of current interconnect architectures. TDK Corporation, a global leader in electronics and innovation with over 90 years of history, continues to expand its strategic focus on AI and digital transformation. With a 2025 revenue of $14.4 billion and 105,000 employees worldwide, TDK operates across automotive, industrial, consumer electronics, and energy sectors. Its portfolio includes well-known brands such as TDK, EPCOS, InvenSense, and TDK-Lambda. TDK Ventures, established in 2019 as a wholly-owned subsidiary, specializes in early-stage investments in deep-tech startups that align with TDK’s core competencies in materials science, power systems, and advanced electronics. The venture arm provides not only capital but also technical expertise and access to TDK’s global markets, helping portfolio companies scale rapidly. This investment underscores growing recognition that AI’s future depends not just on algorithmic advances but also on breakthroughs in underlying infrastructure. By backing Mixx, TDK Ventures is positioning itself at the forefront of the next wave of computing, where efficient, high-speed data movement is as critical as the AI models themselves. The success of this platform could have far-reaching implications, enabling faster, more sustainable, and more powerful AI systems worldwide.