A team of researchers and engineers has successfully developed the first monolithic 3D chip fabricated in a U.S. semiconductor foundry, marking a major milestone in advanced chip manufacturing. The breakthrough delivers the densest 3D chip wiring ever achieved and enables order-of-magnitude improvements in processing speed, with significant implications for artificial intelligence and high-performance computing. Unlike traditional 2D chips or stacked 2.5D designs that rely on interconnects between separate dies, this new monolithic 3D chip integrates multiple layers of circuitry into a single, seamless structure. The innovation was made possible through a novel fabrication process developed by the team, which includes researchers from academic institutions, national labs, and industry partners. The chip was manufactured at a U.S.-based foundry, a critical achievement given the global dominance of Asian semiconductor production and the strategic importance of domestic advanced chip capabilities. The dense interconnects between layers allow data to move much faster and with less energy than in conventional designs, reducing bottlenecks that have long limited performance. In early tests, the chip demonstrated speed improvements of up to 10 times over comparable 2D chips, with the potential to further enhance the efficiency of AI workloads, such as large language model inference and training. This advancement comes at a pivotal moment as demand for faster, more efficient chips surges, particularly in AI and machine learning. The ability to build such complex 3D structures domestically strengthens U.S. technological sovereignty and reduces reliance on foreign manufacturing for cutting-edge semiconductors. The team says the process is scalable and could be adapted for future generations of chips, potentially enabling even greater density and performance. With support from federal agencies and private investment, the project underscores a growing push to reinvigorate the U.S. semiconductor industry and secure leadership in next-generation computing.