Bruker Ships 15th Advanced Metrology System to Support AI Chip Manufacturing Demand

Bruker Corporation (Nasdaq: BRKR) has announced the shipment and installation of its 15th InSight WLI 3D optical metrology system to a leading semiconductor manufacturer. This installation is part of a major order for 27 such systems, scheduled for delivery and installation in 2025. The order underscores the growing demand for high-performance metrology solutions, which are crucial for supporting advanced packaging requirements in the latest generation of AI-driven high-performance chips. The rise of artificial intelligence (AI) in consumer and industrial technologies necessitates chips with higher performance, faster data processing, and greater energy efficiency. To achieve these goals, semiconductor companies are adopting advanced packaging techniques. Unlike traditional methods, advanced packaging allows for the integration of multiple chips into a single, compact unit, supporting multi-die stacking and heterogeneous integration. This approach combines processor, memory, and accelerator chips into cohesive systems, which are vital for handling AI workloads. However, advanced packaging also poses significant manufacturing challenges, particularly in precision alignment and ensuring structural integrity. Bruker’s advanced metrology systems are essential in addressing these issues, helping to maintain high yields and product quality. David V. Rossi, President of Bruker Nano Surfaces and Metrology Division, highlighted the company’s long-standing commitment to the semiconductor industry. “For decades, Bruker has worked closely with semiconductor manufacturers to develop metrology solutions that align with the industry’s demanding roadmaps,” he said. “This latest multi-system order for advanced packaging metrology further validates the critical role our technology plays in driving the industry forward, especially in the transition to advanced packaging for AI chip manufacturing.” Bruker’s InSight WLI system is tailored for advanced packaging measurements, offering non-contact, high-resolution 3D optical metrology. It accurately measures layer-to-layer alignment, surface topography, and coplanarity—key factors in ensuring the performance and reliability of advanced semiconductor packages. With new fabrication facilities coming online, Bruker expects continued strong demand for its cutting-edge metrology solutions. About Bruker Corporation – Leader of the Post-Genomic Era Bruker is at the forefront of enabling scientific and engineering breakthroughs that enhance the quality of human life. The company’s high-performance scientific instruments and innovative analytical and diagnostic solutions allow researchers to explore life and materials at molecular, cellular, and microscopic levels. Bruker collaborates closely with customers to drive advancements in various fields, including post-genomic life science research, applied and biopharma applications, microscopy and nanoanalysis, industrial and clean technology research, and next-generation semiconductor metrology, particularly in AI chip development. Their diverse portfolio includes high-value systems and solutions for preclinical imaging, clinical phenomics research, proteomics and multiomics, spatial and single-cell biology, functional structural and condensate biology, as well as clinical microbiology and molecular diagnostics. For more information, visit www.bruker.com. More News From Bruker Corporation