Intel Unveils 18A-PT for 3D Die Stacking, Details 14A Performance Enhancements

At the Intel Foundry Services 2025 (Intel Foundry Direct 2025) event held in San Jose, California, new Intel CEO Lip Bu-Tan unveiled significant advancements in the company's foundry business, particularly focusing on its upcoming 14A and 18A process nodes. These updates highlight Intel's efforts to reclaim its leadership in cutting-edge semiconductor manufacturing and to strengthen its competitive position against leading rivals like TSMC. Progress on the 18A Node Intel's 18A node has entered the pilot production phase and is expected to ramp up to mass production by the end of 2023. This is a crucial milestone for Intel, as it marks a major step towards regaining parity with, and potentially surpassing, TSMC in high-end manufacturing. The 18A node introduces PowerVia backside power delivery network (BSPDN) and RibbonFET gate-all-around (GAA) transistor technology for the first time. PowerVia optimizes the routing of power lines on the chip's back side, reducing resistance and increasing performance and density. RibbonFET uses four-layer vertical nanosheets, allowing for higher transistor density and faster switching speeds on smaller chips. Intel has also developed two variants of the 18A node to cater to diverse customer needs: the 18A-P and 18A-PT. The 18A-P variant offers a 5-10% improvement in performance/energy efficiency compared to the standard 18A node. The 18A-PT variant further integrates Foveros Direct 3D hybrid bonding technology, enabling copper-to-copper direct bonding without bumps and using silicon vias (TSVs) with less than 5 micrometers pitch to stack multiple chips vertically. This technology advancement positions Intel strongly in 3D packaging, rivaling TSMC's SoIC-X with a 9-micrometer bump pitch. Development of the 14A Node Intel is actively working on the next-generation 14A process node, expected to become the first in the industry to use high-numerical aperture (High-NA) EUV lithography. While no exact timeline is set, Intel aims for a risk production phase in 2027, which could lead to significant improvements in power consumption and per-watt performance, estimated at up to 35% and 15-20%, respectively. TSMC plans to roll out its A14 node (equivalent to 1.4 nm) in 2028 but will not adopt High-NA EUV. The 14A node builds upon the 18A node with an enhanced version of PowerVia called PowerDirect. This technology directly powers each transistor’s source and drain through dedicated contacts, further reducing resistance and enhancing energy efficiency. Additionally, the 14A node offers a wider threshold voltage range, optimizing the chip's operation under various conditions and increasing density by 1.3 times compared to the 18A node. Turbo Cells Technology A significant innovation in the 14A node is the Turbo Cells technology, a customizable design method that boosts key path (speed path) performance in CPUs and GPUs. In chip design, the longest delay in signal paths, known as critical paths, can limit the highest clock speed of a processor. Typically, improving these paths requires higher-performance transistors, which can reduce density and increase power consumption. Turbo Cells address this by increasing the drive current in standard library cells for short-term use, maintaining high density and enhancing performance. This flexibility allows designers to achieve optimal balance between power efficiency, performance, and area (PPA). Three Standard Cell Libraries To support various design requirements, Intel has optimized three standard cell libraries for the 14A node: 1. "High" library, designed for maximum performance but lower density and higher leakage. 2. "Medium" library, focused on balanced energy efficiency and performance. 3. "Short" library, geared towards high-density applications, especially those that demand low power consumption and compact designs. Advancement in Mature Nodes In addition to these leading-edge process nodes, Intel is expanding its capabilities in mature nodes. The company has completed the first production tapeout on its 16 nm node and is engaging with customers regarding 12 nm node demands. The 12 nm node, developed in collaboration with United Microelectronics Corporation (UMC), is scheduled to start production at three factories in Arizona in 2027. It will primarily serve mobile communication infrastructure and networking applications, leveraging the strengths of Intel's manufacturing expertise. Ecosystem Expansion Intel emphasized the importance of its ecosystem partnerships, collaborating with leading electronic design automation (EDA) software companies like Synopsys and Cadence to offer industry-standard design tools and support. The company also joined the Intel Foundry Chiplet Alliance, allowing customers to mix and match different chip modules in their designs. Advanced packaging services, especially 3D stacking technologies, are expected to drive substantial revenue growth for Intel in the near term. A new partnership with Amkor focuses on sharing more details about the Foveros 3D stacking technology, further broadening Intel's manufacturing ecosystem. Industry Evaluation and Company Profile Industry insiders view Intel's foundry business advancements, especially in advanced packaging and next-generation process nodes, as a strong indicator of its renewed focus and technological prowess in semiconductor manufacturing. The company's unique position as a U.S.-based high-end manufacturer becomes increasingly valuable in the current geopolitical climate, where tensions between China and Taiwan could disrupt global supply chains. Intel's new technologies and strategic partnerships are expected to attract more international clients, particularly in the realms of high-reliability and high-performance computing. As one of the world's leading chip manufacturers, Intel's commitment to innovation and technological leadership is evident in these recent announcements. With a history of driving technological boundaries, Intel aims to set new standards and influence future trends in chip design and manufacturing. These developments underscore the company's dedication to maintaining and enhancing its competitive edge in the semiconductor sector.