HyperAI
Back to Headlines

YES Supplies Multiple VertaCure LX Systems to Top Taiwanese OSAT Provider for Advanced Semiconductor Packaging

2 days ago

FREMONT, Calif.--(BUSINESS WIRE)--Yield Engineering Systems (YES), a prominent provider of process equipment for AI and HPC semiconductor applications, has announced the delivery of multiple VertaCure™ LX curing systems to one of Taiwan’s top outsourced semiconductor assembly and test (OSAT) providers. These systems are designed to support advanced packaging processes for Edge Computing and High-Performance Computing (HPC) solutions, offering critical functionalities such as low-temperature curing, annealing, and degassing for Wafer-Level Chip-Scale Packages (WLCSP), Plated Bump, and Cu Pillar applications. The VertaCure™ LX is a fully automated vacuum curing and degassing system engineered to ensure uniform temperature distribution and precise control over heating and cooling rates. This technology results in complete solvent removal, enhanced film properties, and the elimination of post-cure outgassing, along with outstanding particle performance. YES's products have consistently delivered superior quality in curing, coating, and annealing, serving both research and development (R&D) and high-volume manufacturing (HVM) environments. Rezwan Lateef, President of YES, highlighted the significance of this development: "The VertaCure family has established itself as the industry’s most widely adopted HVM curing solution for 2.5D packaging. These systems provide exceptional mechanical, thermal, and electrical performance across wafer-level, 2.5D, and 3D packages. We are thrilled to see growing demand from OSAT customers, which further cements our position as a market leader in advanced packaging." Alex Chow, Senior Vice President of Sales and Business Development and Asia President at YES, added: "The VertaCure LX systems offer more than a 30% improvement in thermal uniformity and a 30% reduction in the cost of ownership in HVM settings. We expect to receive additional and volume purchase orders from this customer in 2026. This delivery represents a significant milestone, reinforcing YES's reputation as the premier provider of curing technology for advanced packaging." About YES YES is a leading provider of specialized technologies for materials and interface engineering, catering to a diverse range of application and market needs. The company serves market leaders developing next-generation solutions for sectors including Advanced Packaging for AI and HPC, Memory Systems, and Life Sciences. YES is recognized for manufacturing cost-effective, high-volume production equipment for semiconductor Advanced Packaging, specifically for wafers and glass panels. Their product lineup includes Vacuum Cure, Coat & Anneal Tools, Fluxless Reflow Tools, Thru Glass Via and Cavity Etch Tools, and Electroless Deposition Tools. Headquartered in Fremont, California, YES continues to expand its global presence. For more information, visit YES.tech.

Related Links