LONDON & TORONTO—Alphawave Semi (LSE: AWE), a leading provider of high-speed connectivity and compute silicon for global technology infrastructure, has successfully taped out one of the first UCIe™ IP subsystems on TSMC’s N2 process, capable of supporting 36G die-to-die data rates. This achievement, fully integrated with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS®) advanced packaging technology, marks a significant step forward in bandwidth density and scalability for next-generation AI platforms. Alphawave Semi’s tape-out represents a crucial milestone in the development of nanosheet processes. By leveraging TSMC’s cutting-edge N2 manufacturing technology, Alphawave Semi has created an IP subsystem that significantly enhances the performance and efficiency of multi-die chip designs. The UCIe™ interface, designed to standardize and optimize the communication between different chiplets, plays a pivotal role in this advancement. With a data rate of 36G, the new IP subsystem will enable seamless and high-speed communication within complex chip architectures, which is essential for scaling AI applications and other data-intensive tasks. The integration with CoWoS® further underscores Alphawave Semi’s commitment to pushing the boundaries of chip design. CoWoS® is an advanced 2.5D and 3D chiplet integration technology that allows for multiple dies to be interconnected on a single substrate, leading to increased performance and reduced form factors. This combination of UCIe™ IP and CoWoS® technology opens up new possibilities for developing highly optimized, large-scale AI platforms that can handle vast amounts of data with unprecedented efficiency. Alphawave Semi’s breakthrough comes at a critical time for the semiconductor industry, as the demand for high-performance AI chips continues to soar. The company’s innovative solutions are expected to address several key challenges, including power consumption, thermal management, and data throughput, which have been major bottlenecks in the development of efficient AI systems. By providing a robust and scalable solution, Alphawave Semi is positioned to support the rapid growth of AI-driven applications, from cloud computing and edge devices to autonomous vehicles and high-performance computing. Dr. Tony Pialis, CEO of Alphawave Semi, commented on the achievement: “This tape-out on TSMC’s 2nm process is a testament to our team’s expertise and dedication. It positions us at the forefront of the industry, enabling the creation of advanced AI platforms that are both powerful and energy-efficient. Our collaboration with TSMC has been instrumental in achieving this goal, and we look forward to continuing our partnership to drive further innovation.” The announcement also highlights the strategic importance of TSMC’s N2 process, which is set to pave the way for the next generation of semiconductor advancements. TSMC’s 2nm technology offers enhanced performance, power efficiency, and reduced physical dimensions, making it an ideal choice for high-density, low-power applications. By utilizing this process, Alphawave Semi can create more compact and powerful chip designs that meet the demands of advanced AI and compute environments. In addition to its immediate benefits, this development holds long-term implications for the broader technology landscape. As AI and machine learning continue to evolve, the need for specialized hardware that can efficiently process and manage large datasets becomes increasingly critical. Alphawave Semi’s 36G UCIe™ IP on TSMC’s N2 process not only meets current needs but also sets a foundation for future advancements in AI chip design, potentially influencing the direction of research and development in the field. The successful tape-out is a result of extensive collaboration between Alphawave Semi and TSMC, combining the former’s leadership in high-speed connectivity and the latter’s expertise in advanced manufacturing. This partnership is anticipated to yield a series of high-performance, energy-efficient products that will revolutionize the way data is processed and managed in various computing environments. As the technology progresses, Alphawave Semi plans to expand its offering, incorporating additional features and enhancements to further improve the capabilities of its chip designs. The company remains committed to addressing the growing complexities of modern AI and compute systems, ensuring that its solutions remain at the cutting edge of the industry. Overall, Alphawave Semi’s achievement with the 36G UCIe™ IP on TSMC’s 2nm process signifies a major leap forward in semiconductor technology. It not only addresses current performance and efficiency challenges but also sets the stage for future innovations that will continue to shape the landscape of AI and high-performance computing.