AMD Reveals 2027 Plans: Next-Gen Verano CPU, Instinct MI500X GPU, and Advanced AI Rack-Scale Solution

AMD has unveiled ambitious plans for 2027, focusing on the rapid advancement of its CPU, GPU, and rack-scale AI solutions. At its recent Advancing AI event, the company shared details about the upcoming EPYC 'Verano' CPU, Instinct MI500X series GPUs, and the next-generation rack-scale AI system. Lisa Su, AMD’s CEO, emphasized the company's commitment to pushing the boundaries of performance, efficiency, and scalability with these new products. While AMD's 2026 offerings already promise significant improvements, the 2027 lineup is expected to be even more impressive. In 2026, AMD will introduce its first in-house designed Helios rack-scale system for AI, featuring a 256-core EPYC 'Venice' processor, which is anticipated to deliver a 70% performance improvement over the previous generation. The system will also include Instinct MI400X-series accelerators, expected to double AI inference performance compared to the current Instinct MI355X, and Pensando 'Vulcano' 800 GbE network interface cards (NICs) compliant with the UEC 1.0 specification. Looking ahead to 2027, AMD plans to roll out the second generation of its rack-scale AI system. This advanced setup will be powered by the new EPYC 'Verano' processors, Instinct MI500X GPUs, and the same Pensando 'Vulcano' 800 GbE NICs. Although specific details and performance metrics for the 2027 system have not been disclosed, AMD provided a sneak peek through an image that suggests the inclusion of additional compute blades, enhancing performance density. This implies a notable boost in both performance and power consumption, crucial for competing with rivals like Nvidia’s NVL576 'Kyber' system, which is based on 144 Rubin Ultra packages, each containing reticle-sized compute elements. The timing of AMD's 2027 product launches aligns well with TSMC's introduction of its A16 process technology, scheduled for late 2026. The A16 node is the first to support backside power delivery, a critical feature for high-performance data center CPUs and GPUs. While AMD has not confirmed if it will use TSMC's A16 process, it is reasonable to speculate that the company might leverage this advanced manufacturing technology to achieve its aggressive performance goals. Overall, AMD's 2027 roadmap signals a strong push into the high-performance AI market, promising to deliver more powerful and efficient systems to meet the growing demands of artificial intelligence applications. Stay tuned for more updates from Tom's Hardware on Google News to keep up with the latest news, analysis, and reviews in the tech industry. Make sure to follow us by clicking the Follow button.