TSMC Unveils A14 Process; OKI Develops 124-Layer PCB Tech

TSMC Launches Next-Generation A14 Process at North America Technology Symposium In a recent development, TSMC, the world’s leading semiconductor foundry, unveiled its latest logic process technology, A14, at the North America Technology Symposium held in Santa Clara, California. This new technology is designed to enhance computing performance and energy efficiency, driving advancements in artificial intelligence (AI). According to TSMC, A14 offers a speed boost of up to 15% over the upcoming N2 process at the same power consumption level, reduces power usage by up to 30% at the same speed, and increases logic density by more than 20%. These improvements are expected to significantly elevate AI performance, making smartphones and other devices smarter with richer integrated AI features. Dr. Mark Liu, TSMC's Chairman and CEO, emphasized, “Our customers always look towards the future. TSMC's technological leadership and excellent manufacturing capabilities provide them with a reliable roadmap for innovation.” The company’s comprehensive suite of new technologies and solutions extends beyond A14 to include advancements in high-performance computing (HPC), smartphones, automotive, and the Internet of Things (IoT). High-Performance Computing To meet the growing demands of AI, TSMC is enhancing its chip packaging technology, specifically the CoWoS®. The 9.5-inch reticle CoWoS can integrate 12 or more HBM (High Bandwidth Memory) stacks and will be paired with TSMC's advanced logic processes. It is scheduled for production in 2027. Additionally, the TSMC-SoW™ (System on Wafer) technology, set to debut in 2024, has been further developed into SoW-X, which aims to boost system-level wafer computational performance by 40 times. SoW-X is also slated for production in 2027. Smartphones Supporting AI applications on edge devices and their requirements for low latency and high-speed wireless connections, TSMC introduced the N4C RF high-frequency process. Compared to the current N6RF+, N4C RF reduces power consumption and die area by 30%, making it ideal for integrating more digital content into RF SoCs to support emerging standards such as WiFi8 and true wireless stereo. Risk production for N4C RF is planned to start in the first quarter of 2026. Automotive Advanced driver assistance systems (ADAS) and autonomous vehicles (AV) demand flawless computational power. TSMC’s N3A process is nearing final certification for AEC-Q100 Grade 1, focusing on reducing defect rates to meet the stringent quality standards of the automotive industry. Already in production, N3A will bolster software-defined cars, providing robust support for future innovations. IoT As everyday electronic devices and home appliances increasingly incorporate AI functionalities, IoT applications must handle greater computational tasks within limited energy budgets. TSMC’s N6e ultra-low-power process, now in production, significantly improves energy efficiency. The next step is the introduction of the N4e process, which will set new standards for power consumption in future edge AI applications. The North America Technology Symposium, attracting over 2,500 attendees, highlighted TSMC’s latest technological advancements and featured an "Innovation Zone" where startups could showcase their unique products and attract potential investors. This symposium marks the beginning of TSMC's global technology series, with subsequent events to be held in various countries and regions. Industry Insights and Company Profile Industry experts praised TSMC’s new technologies, noting that they solidify the company's position as a leader in semiconductor innovation. TSMC, founded in 1987, revolutionized the semiconductor industry with its pure-play foundry model and has since grown to become the largest and most technologically advanced foundry in the world. Its wide array of manufacturing and technical services supports a broad spectrum of customer needs, from cutting-edge AI to essential electronics components. OKI Develops 124-Layer PCB Technology for Next-Generation AI Test Equipment OKI Electric Industry (OKI Group) announced that its subsidiary, OKI Circuit Technology (OTC), has successfully developed a 124-layer PCB (Printed Circuit Board) technology for next-generation high-bandwidth memory (HBM) semiconductors. This breakthrough increases the number of layers by about 15% compared to the existing 108-layer designs. OTC plans to start mass production of this technology at the Yoseda Plant in Nagaoka, Niigata Prefecture, Japan, in October 2025. The plant is known for its exceptional track record and expertise in producing high-layer-count, high-precision, large-size PCBs. With the increasing data processing demands of AI, modern semiconductors must efficiently transfer large volumes of data. To match the performance of high-performance GPUs, memory used in AI chips, such as HBM, requires faster, higher-frequency, and denser data transmission capabilities. This necessitates thinner, more precise materials and processes, placing higher demands on PCB performance and quality. OTC addressed these challenges by developing ultra-thin materials, tools, and processing techniques, as well as introducing a proprietary automated transport system. The 124-layer PCB maintains a thickness of 7.6 mm, thus improving signal transmission efficiency and reliability. This technology will be showcased at the PCB East 2025 exhibition held at the Boxboro Regency Hotel & Conference Center in Massachusetts, USA, from April 30 to May 2, 2025. Visitors can experience and learn more about this groundbreaking technology at OTC’s booth, number 305. Industry Evaluation and Company Background Industry insiders have lauded OTC's 124-layer PCB technology, recognizing its significant contributions to the advancement of AI semiconductors, aerospace, defense, robotics, and next-generation communication systems. This achievement underscores OTC's robust innovation capabilities and technical prowess in PCB manufacturing. Founded in 1881, the OKI Group has long been a pioneer in information and communication technology. OTC, a core member of the OKI Group, brings extensive experience and leading-edge technology to the table, further cementing its role as a frontrunner in the high-tech sector. These technological advancements by TSMC and OTC highlight the ongoing evolution and innovation in the semiconductor industry, addressing both immediate market needs and laying the groundwork for future technological breakthroughs.