"AI in Chip Manufacturing and Electroplating: Experts Convene at Shanghai University to Explore Technological Advancements and Industry Integration"

On April 13, the "2025 Shanghai Symposium on AI Applications in Chip Manufacturing and Electroplating" was successfully held at the Lehu New Building on the main campus of Shanghai University. The symposium was jointly organized by the Shanghai Electronics Society’s Electroplating Special Committee and the Department of Chemistry at Shanghai University’s College of Science. Over 60 experts and scholars from universities, research institutions, enterprises, and government agencies attended the event. Key figures included Shanghai University's Party Secretary Cheng Danhong, Vice Secretary Cao Weimin, the Electroplating Special Committee's Honorary Chairman Yu Zuzhan, Chairman Xu Qunjie, Secretary Wan Chuan Yun, the Department of Chemistry’s Party Branch Secretary Xing Feifei, Department Head Li Jian, and Deputy Head Zhao Hongbin. In his opening remarks, Secretary Cheng Danhong emphasized that in the new era, the artificial intelligence (AI) industry and integrated circuit manufacturing are presenting significant opportunities to professionals. This symposium offers a valuable platform for academic exchange and collaboration, contributing positively to the integration of industry, academia, and research, as well as fostering technological innovation and industrial upgrading. He reaffirmed Shanghai University’s commitment to open cooperation, aiming to strengthen ties with the industry and provide a broader stage and resources for talent development and scientific research in the field of electroplating. During the presentation session, Zeng Zhaoqin, a representative from a chip manufacturing company, discussed "Damascus Copper Process Introduction and Big Data Exploration." He introduced the metal interconnect technology used in chip manufacturing, highlighted three cases of improvements and breakthroughs in copper processes as feature sizes continue to shrink, and explained how AI and machine learning can enhance root cause analysis, model creation, and process optimization. Dr. Chen Shuguang from the University of Hong Kong presented "AI and Simulation Technology Applications in the New Energy and Semiconductor Fields." He shared specific examples of AI’s practical applications in new energy and semiconductor materials, offering insights and suggestions for further exploration in chip manufacturing and electroplating. Professor Lu Wencui from Shanghai University delivered a cutting-edge report titled "Empowering New Material Scientific Innovation with Digital Intelligence Technology." His presentation covered various aspects of digital intelligence technology, including material scientific innovation, empowering case studies, and future trends. He introduced self-developed technologies such as ultra-polyhedron characteristic screening, quantitative and directional reverse design, and optimal automatic control zone modeling. He also shared projects on the development of high-entropy alloys and the optimization of current efficiency in aluminum electrolysis cells, and discussed several directions for applying AI in chip intelligent manufacturing. Following the presentations, Dr. Wei Zhongling from Linde Research Center moderated a discussion session. Representatives from multiple enterprises and universities engaged in a deep and lively exchange on the application prospects of AI in chip manufacturing and electroplating, the challenges and progress of AI’s industrialization in chip manufacturing, and strategies for promoting AI’s application through collaboration between industry, academia, and research. This exchange provided diverse perspectives and innovative ideas for addressing common technological challenges and advancing industry innovation. The symposium concluded with a summary speech by Professor Yu Zuzhan from Fudan University. He praised the Electroplating Special Committee and Shanghai University for their efforts in advancing electroplating technology. Professor Yu highlighted the practical and efficient nature of the symposium and expressed his expectations and requirements for the future "AI + Surface Empowerment" engineering projects. He called for the committee to leverage its platform advantages, attract top talent from around the world, delve deeper into electrocrystallization technology, and drive a strategic transformation in the electroplating industry, contributing to the global chip and semiconductor sectors with Chinese expertise. This symposium is a continuation of the collaborative efforts between the Shanghai Electronics Society’s Electroplating Special Committee and Shanghai University’s Department of Chemistry, following the "2024 Shanghai Chip Manufacturing and Packaging Electroplating Symposium." The event aims to continuously refine and expand the technical exchange platform, fostering deeper integration in resource sharing, technological collaboration, and talent development between universities and enterprises. The successful hosting of this symposium has further enhanced Shanghai University’s reputation and influence in the electroplating field. Moving forward, the Department of Chemistry at the College of Science will seize the major historical opportunities, leverage its platform strengths, and strive to optimize and upgrade its talent development system and research and application of electroplating technology. The goal is to play a pivotal role in industry development and contribute to the advancement of the integration of industry, academia, and research.